Phoenix is hosting leading edge AI power electronics and packaging at 3D-PEIM 2026

Explore the latest innovations and cutting-edge research tackling the rapidly evolving demands of AI - and the transformative challenges it is creating across power electronics, advanced packaging, heterogeneous integration, and vertical power delivery. The conference is in Phoenix this year and it is a collaboration of IEEE, ASU and PSMA. This year's symposium places a special emphasis on AI challenges in Power Electronics and Packaging. We will be featuring distinguished plenary speakers: Kaladhar Radhakrishnan (Intel), Yi Zheng (Applied Materials), Cian Ó Mathúna (Tyndall National Institute), Madhavan Swaminathan (Penn State), Stephen Coates (Yuxuan Semi), and Rinkle Jain (NVIDIA), who will discuss topics including: · Power delivery architectures for next-generation AI accelerators · Vertical power delivery for AI computing and data centers · Heterogeneous integration of Vertical power for AI · AI-driven design, modeling, and optimization of power electronics · Advanced packaging technologies for AI high-density power delivery · Materials, thermal management, and reliability challenges for AI hardware Whether your AI power challenges are for compute, power delivery networks, chiplet integration, advanced semiconductor packaging, thermal management, or next-generation power conversion, 3D-PEIM 2026 provides a unique forum to engage with the latest research and connect with leaders from academia and industry who are shaping the future of AI power solutions. Further details for this event can be found at: https://www.3d-peim.org/